IT Module

IT 模块IT Module

IT 模块是算力的核心载体,支持 CPU/GPU 混布,标准化 40 尺高柜集装箱封装,为 AI 训练与推理提供高密度算力支撑。The IT Module is the compute core — supporting CPU/GPU hybrid deployment in standard 40ft high-cube containers, delivering high-density compute for AI training and inference.

核心特性Key Features

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高密度算力High-Density Compute

单柜最高 200kW,支持 GPU 密集部署,满足大模型训练需求。Up to 200 kW/rack — GPU-dense deployment for large model training.

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灵活扩展Flexible Scaling

模块化设计,按需增减 IT 机柜,随业务增长弹性扩容。Modular design — add or remove IT racks on demand as your business grows.

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智能监控Intelligent Monitoring

实时监测机柜温度、功率、湿度,AI 智能调度算力资源。Real-time rack temp/power/humidity monitoring with AI-driven compute scheduling.

技术规格Technical Specifications

机柜数量Rack Quantity9 个9 units
单柜功率Power/Rack最高 200 kWUp to 200 kW/rack
总功率Total Power最高 1000 kWUp to 1000 kW
冷通道温度Cold Aisle Temp18~27℃18~27℃
设计寿命Design Life10 年10 years
机柜配电Rack PowerAB 路 400±10% VA/B 400±10% V
机柜规格 高×宽×深Rack Dim (H×W×D)2200×800×1200 mm2200×800×1200 mm
模块尺寸 长×宽×高Module Dim (L×W×H)12192×2438×2896 mm12192×2438×2896 mm
工作温度Operating Temp-15~50℃-15~50℃